瀏覽器自帶分享功能也很好用哦~NO | Item | Specification | Remarks |
1 | wafer size | 200mm/300mm | adaptor/insert |
2 | Max number of load port | 2 | |
3 | number of process chamber | 6 | LORDLOCK，S1-S4,cooling |
4 | Process temperature | 50-400℃ | 165℃，300℃，235℃，195℃（±20℃） |
5 | Temperature Accuracy | ±1% | |
6 | N2 Load Lock(O2 Concentration) | Install | ≤ 15ppm@30min |
7 | cooling | 20±5℃ | P.C.W |
8 | Aigner/BUFFER | 200mm/300mm | Optional |
9 | WPH | 50PCS/H | |
10 | All equipment | 1725 x 2405 x 2200 (W x D x H mm) | WxDxH |
11 | EFEM | 1725 x 855 x 2200 (W x D x H mm) | WxDxH |
12 | PM | 1725 x 1550 x 2200 (W x D x H mm) | WxDxH |
NO | Item | Specification | Remarks |
1 | wafer size | 200mm/300mm | adaptor/insert |
2 | Max number of load port | 2 | |
3 | number of process chamber | 6 | LORDLOCK，S1-S4,cooling |
4 | Process temperature | 50-400℃ | 165℃，300℃，235℃，195℃（±20℃） |
5 | Temperature Accuracy | ±1% | |
6 | N2 Load Lock(O2 Concentration) | Install | ≤ 15ppm@30min |
7 | cooling | 20±5℃ | P.C.W |
8 | Aigner/BUFFER | 200mm/300mm | Optional |
9 | WPH | 50PCS/H | |
10 | All equipment | 1725 x 2405 x 2200 (W x D x H mm) | WxDxH |
11 | EFEM | 1725 x 855 x 2200 (W x D x H mm) | WxDxH |
12 | PM | 1725 x 1550 x 2200 (W x D x H mm) | WxDxH |
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皖I(lǐng)CP備2025078321號-1